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Reddio
Reddio provides a high-performance parallel EVM Layer 2 solution, utilizing zero-knowledge technology to offer enhanced scalability and security for Ethereum. It features multi-thread parallel execution and GPU acceleration to increase transaction throughput and reduce fees, while maintaining full EVM compatibility for seamless smart contract deployment.
Distributed
Funding Rounds
Funding Round: Series A
Funding Date: 31 May, 2025
Funding Round: Seed
Funding Date: 13 Aug, 2024