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发票业务
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Category: Payments Infrastructure
高灯科技
Funding Rounds
Funding Round: Series A
Funding Date: 1 Sep, 2020
Raised Amount: $15M
Funding Round: Series B
Funding Date: 1 Oct, 2019
Raised Amount: $141M
Funding Round: Seed
Funding Date: 1 May, 2019
Raised Amount: $5M
Funding Round: Series A
Funding Date: 1 Jan, 2018
Raised Amount: $141M
Funding Round: Angel
Funding Date: 1 Jan, 2017
Raised Amount: $29M